Goodrich Sensors and Integrated Systems’ product improvement lab utilizes an investigative engineering and root cause analysis approach to support product development, process optimization and continuous improvement projects. Lab staff collaborates with engineers to utilize their expertise throughout the problem solving process. The lab determines and documents the exact cause of hardware breakdown or weakness within a component, material or process. Advanced laboratory instruments accelerate information gathering and enable root cause failure analysis. Real-time x-ray imaging allows viewing of internal structures while moving the part along five axes. Scanning electron microscopes identify and chemically analyze the mechanism responsible for failure and low yields. With comprehensive investigative resources, problems are efficiently resolved through a systematic approach that utilizes reverse-engineering techniques to discover the precise root cause.

Root cause failure analysis is supported by diverse investigative engineering skills and the following advanced analytical techniques to increase the quality, reliability and value of our products:

• Variable pressure and field emission scanning electron microscopes (VPSEM - FESEM)
• Energy and wavelength dispersive X-ray spectrometers (EDX – WDX)
• Material analysis and plating thickness via X-ray fluorescence (XRF)
• Fourier transform infra-red spectrometer (FTIR)
• Real-time X-ray with digital imaging system
• Hardness and micro-hardness testing
• Semiconductor junction characterization
• Mechanical testing: tension / compression / fatigue
• Material microstructure interpretation and fracture analysis
• Non-destructive test via radiography, ultrasonic, eddy current